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Developing Reprocessable shape memory thermosetting resins with high thermal resistance and strength through building a crosslinked network based on bismaleimide and epoxy resins
dynamic covalent bond heat resistance mechanical property reprocessability shape memory thermosetting resin
2023/11/16
It is difficult to endow reprocessable shape memory thermosetting resins with outstanding heat resistance and high mechanical strength. Herein, a new kind of reprocessable shape memory thermosetting r...
Preparation and properties of mesoporous silica/bismaleimide/diallylbisphenol composites with improved thermal stability, mechanical and dielectric properties
thermosetting resins bismaleimide meosoporous silica dielectric properties structure-property
2011/12/14
New composites with improved thermal stability, mechanical and dielectric properties were developed, which consist of 2,2!-diallylbisphenol A (DBA)/4,4!-bismaleimidodiphenylmethane (BDM) resin and a n...