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UCLA and USC scientists devise breakthrough technique for mapping temperature in tiny electronic devices
UCLA and USC scientists mapping temperature tiny electronic devices
2015/3/4
Overheating is a major problem for the microprocessors that run our smartphones and computers. But a team of UCLA and USC scientists have made a breakthrough that should enable engineers to design mic...
Optimisation of Temperature Fields of Microsystems with Self-Organising Neural Nets
Thermal problems Temperature fields optimisation Neural nets Microsystems Topography optimisation
2010/12/7
Thermal modelling and optimisation of parameter distributed systems is a rather time-consuming process. In this paper the problem of optimisation of temperature fields of VLSI circuits and systems is ...
Analysis of Temperature and Drain Voltage Dependence of Substrate Current in Deep Submicrometer MOSFET'S
Submicrometer MOSFET’s Impact ionization Substrate current Temperature Channel length
2010/12/8
In this paper, a detailed experimental study of channel length, drain voltage and temperature dependence of substrate current Isub in submicrometer MOSFET's is presented. Impact ionization rate α is r...
Temperature Verification of Hybrid Microelectronic Circuit Design
Temperature Verification Hybrid Microelectronic Circuit Design
2010/12/27
The paper includes temperature measurement results on hybrid microelectronic circuit surfaces carried out by infrared microscope with special attention to critical temperatures (hot spots) which may r...
Thick Film Temperature Compensating Circuit for Semiconductor Strain Gauges
Thick Film Temperature Compensating Circuit Semiconductor Strain Gauges
2010/12/28
Thick film circuits were developed for temperature compensating of semiconductor strain gauges and for connecting the gauges to amplifiers in electronic pressure and differential pressure transmitters...
The Solution of Two-Dimensional Heat Conduction Problems for Predicting Operating Temperature and Power Handling Capabilities of Hybrid Circuits
Two-Dimensional Heat Conduction Problems Temperature and Power Hybrid Circuits
2011/1/21
The problems of heat conduction in hybrid thin and thick film circuits have been investigated using both analytical and numerical approaches.The calculations were restricted to two dimensions by assum...